| Home | 연구개발 |  |
기술 Road Map |  |
|---|
| PROCESS | ITEMS | 2016 | 2017 | 2018 | 2019 | 2020 |
|---|---|---|---|---|---|---|
| INNER LAYER | LINE / SPACE - ① | 50㎛ / 50㎛ | 45㎛ / 45㎛ | 40㎛ / 40㎛ | 35㎛ / 35㎛ | 35㎛ / 35㎛ |
| OUTER LAYER | LINE / SPACE - ② | 60㎛ / 60㎛ | 55㎛ / 55㎛ | 50㎛ / 50㎛ | 45㎛ / 45㎛ | 40㎛ / 40㎛ |
| LASER DRILL | BVH DIAMETER - ③ BVH LAND - ④ ANNUAL RING – ⑤ |
125㎛ 325㎛ 100㎛ |
110㎛ 260㎛ 75㎛ |
100㎛ 240㎛ 70㎛ |
85㎛ 215㎛ 65㎛ |
75㎛ 195㎛ 60㎛ |
| MECHANICAL DRILL | PTH DIAMETER - ⑥ PTH LAND - ⑦ ANNUAL RING - ⑧ |
150㎛ 350㎛ 100㎛ |
100㎛ 250㎛ 75㎛ |
80㎛ 220㎛ 70㎛ |
80㎛ 210㎛ 65㎛ |
75㎛ 195㎛ 60㎛ |
| FINISH PLATTING |
ELECTROLESS Ni/Au SOFT ENIG ELECTRO SOFT/HARD(Ni/Au) IMMERSION Tin ELECTRO Tin ENEPIG |
1㎛ ~ 8㎛ / 0.03㎛ ~ 0.1㎛ 1㎛ ~ 5㎛ / 0.03㎛ ~ 0.1㎛ 1㎛ ~ 8㎛ / 0.03㎛ ~ 0.1㎛ 0.4㎛ ~ 0.8㎛ 5㎛ ~15㎛ Ni 3㎛ ~ 8㎛ / Pd 0.05㎛ ~ 0.15㎛ / Au Min. 0.05㎛ | ||||
